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Para Aramid Paper YT836

Para-aramidpaperYT836,itsheatresistanceandthermalstabilitythanmeta-aramidpaperbettermechanicalstrength.Canbeusedforsomespecialrequirementsofthefield,suchas:high-frequencycircuitboardsubstrate,lithiumb
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Para-aramid paper YT836, its heat resistance and thermal stability than meta-aramid paper better mechanical strength. Can be used for some special requirements of the field, such as: high-frequency circuit board substrate, lithium battery separator. After its honeycomb is made with high specific strength and specific stiffness, it can be used in large rigid and secondary stressed structural parts of aircraft, trains and ships.

Corresponding parameter set not found, please add it in property template of background

民士达YT836系列产品典型指标

标准厚度

mil

1.5

2

3

测试方法

mm

0.04

0.05

0.08

典型厚度

mm

0.047

0.055

0.085

GB/T451.3-2002

基准重量

g/

35

43.5

67

GB/T451.2-2002

抗张强度N/cm

MD

32

38

50

GB/T12914-2008

CD

15

21

32

伸长率%

MD

1.4

1.4

1.2

CD

1.4

1.4

1.2

撕裂度1)  N

MD

0.70

1.00

1.55

GB/T455-2002

CD

1.20

1.50

2.20

介电常数2)

 

1.4

1.4

1.5

GB/T1409-2006

介质损耗因子2)

×10-3

3

3

4

 

1)艾尔门道夫撕裂度 2)测试频率50HZ,使用仪器西林电桥,电极∮50mm

MD纵向,CD横向

请注意:数据表中的数据均属典型值,不可用作技术规范,除另有说明,所有数据均是在“标准条件”下测得(温度23℃,相对湿度为50%RH),同其它造纸

技术的产品一样,Metastar芳纶纸在纵、横向机械性能指标有些差别,在某些应用场合可以通过调整纸的方向,发挥其最佳性能。

暂未实现,敬请期待
暂未实现,敬请期待
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